Antipathogenic copper coatings: electrodeposition process and microstructure analysis

Abstract Copper coatings are an important group of decorative-protective materials characterised by high corrosion resistance, excellent thermal and electrical conductivity, which lately gained more significance due to their antimicrobial activity. The main aim the presented research was electrodeposit homogenous copper from non-cyanide electrolyte solution in galvanostatic conditions on steel (1.4024) nickel (Ni201) substrates, commercially used for surgical instruments. effect substrate finishes production line, shot peening with glass balls, corundum treatment brushing surface formation, investigated. substrates’ coatings’ microstructural properties were analyzed scanning transmission electron microscopy, atomic force X-ray diffraction analysis. current efficiency reduction substrates found be above 95%. layers adhere both except those deposited a brushed surface. Regardless used, they have nanocrystalline structure average crystallite size 30 nm. Moreover, coating morphology, affects nature interaction microorganisms, effectively modified appropriate finishing without changing electrodeposition conditions.